SolidVUE will showcase its SL-2.2 at CES 2025—the world’s first 400x128 high-resolution single-chip LiDAR sensor IC designed for compact solid-state LiDAR. Paired with a VCSEL array-based emitter, this technology offers lower cost, smaller size, and improved vibration reliability compared to traditional mechanical LiDAR. The SL-2.2 integrates a high-density SPAD pixel array, time-to-digital converter (TDC), image signal processor, and peripheral circuits on a single chip. It delivers 400x128 high-resolution 3D point-cloud images with a wide Field-of-View (FOV), enabling precise object detection up to 200 meters, making it ideal for autonomous vehicles, security, and robotics applications.