xMEMS µCooling
xMEMS µCooling (part number XMC-2400) is the first all-silicon fan-on-a-chip bringing active cooling to thin, AI-enabled mobile electronics. The 1mm-thin cooling chip generates airflow to actively cool devices such as smartphones, tablets, laptops, wireless chargers and SSD which are typically only passively cooled today.
Find xMEMS Labs, Inc. at CES 2025
Founded in January 2018, xMEMS Labs is the “X” factor in MEMS innovation with the world’s most innovative piezoMEMS silicon platform delivering the world’s first solid-state True MEMS speakers for consumer audio devices and the world’s first μCooling fan on a chip for smartphones and other thin, performance-oriented devices.
