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2023 Honoree Award

Samsung UFS3.1 1TB and LPDDR5X 16GB Multi-Chip Package

Samsung Electronics
  • 2023 Honoree in Embedded Technologies
In the first integration of 14nm-based 16GB LPDDR5X mobile DRAM and QLC (Quad Level Cell) technology with 7th generation V-NAND 1TB UFS (Universal Flash Storage) 3.1, this Samsung uMCP is providing a giant industry-leading leap forward. The integrated UFS-based multichip package is taking the industry toward much more efficient, higher density, higher-speed, low-power memory for premium smartphones and other leading mobile applications.

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